Daniel J. Lewis, Ph.D. National Institue of Standards and Technology Metallurgy Division, Center for Theoretical and Computational Materials Science Gaithersburg, MD 20874 Phone: 301-975-6139 | Email: [email protected] Office: Materials Building 223, Room B164

Education

B.S. Materials Science and Engineering - Lehigh University (1995)

M.S. Materials Science and Engineering - Lehigh University (1996)

Ph.D. Materials Science and Engineering - Lehigh University (2001)

Research Interests

• Phase Equilibria and Microstructure of Leaded and Lead-free Solders and Solder Alloy Systems
• Solidification of ternary solder alloy systems that exhibit transitional reactions.
• Phase-Field modeling of Alloys
• Modeling of meniscus shapes using Surface Evolver
• Design of Solder Joint Geometry
• Electronic Packaging Materials Characterization, Quality, and Reliability
• Solderability of Surface Mount Components

More Information

Research

Resume

The Double Bubble Problem.

Last updated: February 28, 2002