Educational Background

Doctor of Philosophy, Materials Science and Engineering, February 2001
        "Solidification Modeling of Ternary Transitional Reactions using the BiPbSn System as an Example"
Master of Science, Materials Science and Engineering, October 1996
        "Assembly Yield and Solder Joint Shape Prediction of Gull-Wing Solder Joints"
Bachelor of Science, Materials Science and Engineering, June 1995
Lehigh University, Bethlehem, PA 18015

Current Research Interests

• Phase Equilibria and Microstructure of Leaded and Lead-free Solders and Solder Alloy Systems
• Solidification of ternary solder alloy systems that exhibit transitional reactions.
• Phase-Field modeling of Ternary Alloys
• Modeling of meniscus shapes using Surface Evolver
• Design of Solder Joint Geometry and Solder Joint Reliability
• Electronic Packaging Materials Characterization, Quality, and Reliability
• Solderability of Surface Mount Components

Technical Skills

• Trained in Scanning Electron Microscopy (SEM) and Transmission Electron Microscopy (TEM)
• Thermal Analysis (DSC)
• Metallography and Optical Microscopy
• Image Analysis
• Thermomechanical Analysis (TMA)
• Thermal characterization of IC packages
• Surface Evolver software.

Work Experience

Metallurgist, National Institute of Standards and Technology, Metallurgy Division and Center for Theoretical and Computational Materials Science, Gaithersburg, MD
Summer 1997, February 2001-Present

• Performed directional solidification experiments on AgCuSn eutectic alloys.
• Used phase field modeling to investigate 3D effects on the morphology selection of eutectic growth.
• Learned Scheil and phase-field models for alloy solidification.
• Started developing ternary phase-field models of alloy solidification and Ostwald ripening.
• Using Surface Evolver software and solder joint model, calculated force exerted on leaded components by liquid solder.
• Modeled shapes of connected, precipitating phases at boundaries of Kelvin's tetrakaidecahedra.

• Evaluate and improve design of IC packges to maximize solder joint reliability.
• Model 2nd level reliability for BGA and flip-chip packages based on customer input.
• Selected materials for Plastic Ball Grid Array, Cavity Fill, and Flip-Chip packages.
• Set up thermal lab and designed natural and forced air convection test fixture to accomodate various package sizes.
• Quantified soldering assembly yield as a function of component coplanarity and solder volume.
• Modeled solder joint geometry with manufacturing variables as inputs.
• Performed failure analysis of gull-wing solder joints in solderability trial.
• Prepared metallographic analysis of long term reliability testing of tin-lead solder in ball grid array (BGA) packages.
• SEMATECH delegate serving on Underfill and Interfacial Integrity Enhancement Committee.

• Operated and performed maintenance of SEM and TEM.
• Learned electron diffraction, secondary and backscatter electron technique.
• Learned energy dispersive spectroscopy, gold-palladium sputtering, and carbon evaporating.
• Presented lab demonstrations for prospective and undergraduate students.
• Responsible for all undergraduate training.

• Learned metallographic techniques including automated sample preparation and image analysis.
• Prepared informational posters on metallurgical topics.
• Learned photography and darkroom procedures.

Conferences Attended - (Titles of Papers and Posters Presented)

1998 Surface Mount International Conference, San Jose, California, August 23-27, 1998

48th Electronic Components and Technology Conference, Seattle, Washington, May 25-28, 1998

1995 Solder Interconnect Design Team Workshop, NIST, Gaithersburg, Maryland, June 12-14, 1995
1996 Solder Interconnect Design Team Workshop, NIST, Gaithersburg, Maryland, April 24-26, 1996
1997 Solder Interconnect Design Team Workshop, NIST, Gaithersburg, Maryland, June 9-11, 1997

21st Annual, IPMI Conference, San Fransisco, California, June 15-18, 1997

TMS Fall Meeting, Cleveland, Ohio, October 29-November 2, 1995
TMS Winter Meeting, Anaheim, California, February 4-8, 1996
TMS Winter Meeting, Orlando, Florida, February 10-13, 1997
TMS Winter Meeting, San Antonio, Texas, February 15-19, 1998

Gordon Research Conference on Physical Metallurgy - Modeling of Materials and Microstructure for Optimal Properties and Performance, July 28-August 2, 1996

Academic Honors

Best In Show, Jacquet-Lucas Award - "Ag-Cu-Sn Ternary Eutectic Structure Determination" 2000 International Metallographic Contest.
Hutchen's Grant - awarded by Surface Mount Technology Association for research in solder alloys.
IPMI Graduate Student Award - awarded for research on solder alloys containing gold and silver.
Hornor Fellowship for 1996-97 academic year.
Presidential Scholarship towards Master's Degree in 5th year.
Dean's List - Spring 1994, Fall 1994, Spring 1995.
Engineer-In-Training
Nevius Award - awarded for leadership, citizenship and scholarship.
Cyril A. Osbourne Award - to senior with outstanding promise for a successful career.
EMSA Undergraduate Scholarship - to assist an undergraduate project to completion.
Honorable Mention - "Hidden Structures" 1994 International Metallographic Contest.
Won Symmetry Scapes poster contest for application of Wulffman to experimental crystal shapes.

Academic, Professional, and Extracirricular Activities

TMS
ASM International
IPMI
SMTA
Alpha Sigma Mu - Chapter President, 1995
Tau Beta Pi
Sigma Xi
Jazz Ensemble - Stage Manager
Delta Sigma Phi Fraternity - Alumni Relations, Steward
Student Materials Society - Chapter President, 1995
Judge for Lehigh Valley Science Fair
Judge for Junior Academy of Science Science Fair

Publications

D. Lewis, J. Warren, and D. Josell, A New Solder Joint Design Tool for IC Package Designers, Proceedings of the 48th ECTC, p. 793, May 1998.

D. Lewis, M. Notis, A. Grusd, Phase Equilibria Near the AuPbSn Ternary Eutectic, Journal of Phase Equilibria, October 2000.

D. Lewis, M. Notis, A. Scotch, S. Allen, Determination of the AgCuSn Ternary Eutectic Structure, In progress.

D. Lewis, M. Notis, D. Gupta, Tracer Diffusion of Ag110 in PZT Ceramics, DIMAT 2000 and Journal of the American Ceramic Society