Solder Interconnect Design Group

gullwing joint moving gullwing joint

The Solder Interconnect Design Group consists of members from academia and industry who are interested in modeling solder joint formation and failure in electronic manufacturing. The groups main focus has been predicting and characterizing solder joint shape formation in flip-chip, gull-wing and other styles of joint. Surface Evolver has been the main modeling tool promoted by the group for this purpose. Surface Evolver finds the minimal surface shape for a molten solder joint of arbitrary geometry.The group is also concerned with continuum modeling during and after reflow. Improved modeling of solder joint systems will allow for more efficient development and implementation of industrial electronic packaging processes. (Contact: Jim Warren)

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