Solder Interconnect Design Group

Second Workshop of the Solder Interconnect Design Team
CTCMS
June 12th-14th, 1995

Workshop Report

Motivation

For three days in June, 1995, scientists and engineers from industry, government and academia met at NIST to establish a collaborative program for the development of software modeling tools for improving solder interconnect geometries with the goals of higher manufacturing yields and higher reliability. Such modeling tools are necessitated by the move toward ever-increasing interconnect densitites without substantial chngers in lead geometries and assembly processes. Assemby solder processes, which worked extremely well at lower interconnection densities, produce increasing numbers of open circuits and shorts, known as solder "bridges." in the final soldered assemblies as the interconnection density increases. Furthermore, decreasing size scales lead to higher thermomechanical stresses on the joints and can result in higher failure rates in service. The ultimate goal of the program will be to create an integrated design, manufacturing simulation, and reliability modeling tool for designing new packaging that meets the interconnection density needs of the electronics industry. The critical need for such modeling tools has been identified by the Semiconductor Industries Association in its SIA Technology Roadmap for advanced packaging systems.

Goals

This group, known as the "Solder Interconnect Design Team," (SIDT) will use the Internet, via the World Wide Web, to provide simple case studies of solder joint geometries common to many types of components, promote communication among group members, and initiate a dialog with package designers and other interested groups about the requirements for the design system. Semiannual workshops will be held at NIST under sponsorship of the MSEL Center for Theoretical and Computational Materials Science.

Participants