Solder Interconnect Design
The Solder Interconnect Design Group is developing and evaluating several
methods for modeling the geometries which arise in solder interconnects.
Improved modeling of these systems will allow for more efficient development
and implementation of industrial electronic packaging processes.
Workshops and Reports
- Minnesota Geometry Center inaugural
workshop on Interconnect Design
- Second
Workshop, Solder Interconnect Design Team
- 1996 Solder
Interconnect Design Team Workshop, NIST, Gaithersburg, Maryland, April
24-26, 1996
- 1996 Solder Interconnect Design Team Workshop, NIST,
Gaithersburg, Maryland, August 19-30, 1996
- Fifth Semi-Annual Workshop, Solder Interconnect
Design Team
- Sixth Semi-Annual Workshop, Solder Interconnect
Design Team, February 19-20, 1998 at NIST.
- Seventh Workshop, Solder Interconnect
Design Team, August, 1998
- Eighth Workshop, Solder Interconnect
Design Team, August 23-25, 1999
Software
Useful Reference Work
Steve Heinrich's nearly comprehensive review of relevent literature on the calculation of equilibrium solder drop shapes.
Workshop Participants